Heat transfer assembly providing heat transfer from a module mounted on a circuit board through the circuit board

A remote PHY device (RPD) comprising:

• an RPD enclosure having a base with at least one raised thermal pedestal,
• wherein at least the base is made of metal;
• a circuit board including a first side, a second side, and a heat transfer aperture passing through the circuit board from the first side to the second side, wherein the circuit board is mounted over the base with the first side facing the base such that the raised thermal pedestal is accessible through the heat transfer aperture from the first side of the circuit board;
• and
• an optical module mounted to the first side of the circuit board over the heat transfer aperture and in thermal contact with the raised thermal pedestal, the optical module including at least an optical transmitter, wherein:
• the raised thermal pedestal includes a thermal pad in contact with the optical module,
• the thermal pad does not extend between any portion of the circuit board and the optical module,
• the base includes at least one additional thermal pedestal, and
• the circuit board includes at least one electronic component mounted to the second side of the circuit board and in thermal contact with the at least one additional thermal pedestal.

An optical node comprising:

• a node housing;
• a remote PHY device (RPD) located in the node housing, the RPD comprising:
• an RPD enclosure having a base with at least one raised thermal pedestal, wherein at least the base is made of metal;
• a circuit board including a first side, a second side, and a heat transfer aperture passing through the circuit board from the first side to the second side, wherein the circuit board is mounted over the base with the first side facing the base such that the raised thermal pedestal is accessible through the heat transfer aperture from the first side of the circuit board;
• and
• an optical module mounted to the first side of the circuit board over the heat transfer aperture and in thermal contact with the raised thermal pedestal, the optical module including at least an optical transmitter, wherein:
• the raised thermal pedestal includes a thermal pad in contact with the optical module,
• the thermal pad does not extend between any portion of the circuit board and the optical module,
• the base includes at least one additional thermal pedestal, and
• the circuit board includes at least one electronic component mounted to the second side of the circuit board and in thermal contact with the at least one additional thermal pedestal.