Loud speaker arrangement with circuit-board-integrated ASIC
AssigneeUSound GmbH
InventorsAndrea Rusconi Clerici Beltrami, Ferruccio Bottoni
Life of this patent
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Abstract
A loudspeaker array includes a MEMS loudspeaker with a diaphragm deflectable along a Z axis; a printed circuit board having a first cavity housing an ASIC electrically connected to the MEMS loudspeaker; and a sound-conducting channel disposed adjacent to the MEMS loudspeaker and having an acoustic outlet opening. The printed circuit board includes a second cavity having an opening, which is closed by the MEMS loudspeaker, so that the second cavity forms at least a part of a cavity of the MEMS loudspeaker. The sound-conducting channel extends at an angle to the Z axis of the MEMS loudspeaker. The acoustic outlet opening is arranged on a side face of the loudspeaker array.
Claims18
Loudspeaker array comprising:
- a printed circuit board in which is defined a first circuit board cavity and a second circuit board cavity, wherein the first circuit board cavity is completely closed, the printed circuit board further defining a side face, the second circuit board defining an opening, the printed circuit board further defining a third circuit board cavity adjacent to the second circuit board cavity;
- a MEMS loudspeaker that defines an edge region, the MEMS loudspeaker including a diaphragm deflectable along a Z axis for generating sound waves in the audible wavelength range and disposed with respect to the opening of the second circuit board cavity so that the second circuit board cavity forms at least a part of a cavity of the MEMS loudspeaker, which is disposed at least partially in said third circuit board cavity in such a way that the third circuit board cavity envelops the edge region of the MEMS loudspeaker in a form-fitting manner;
- a sound-conducting channel, which is adjacent to the MEMS loudspeaker and extends at an angle to the Z axis of the MEMS loudspeaker and which has an acoustic outlet opening arranged on the side face of the printed circuit board;
- and
- an ASIC, which is disposed in the first circuit board cavity of the printed circuit board and completely integrated into the printed circuit board and electrically connected to the MEMS loudspeaker.
Loudspeaker array comprising:
- a printed circuit board in which is defined a first circuit board cavity and a second circuit board cavity, the printed circuit board further defining an outer face, the second circuit board cavity defining an opening and the first circuit board cavity being completely closed;
- a MEMS loudspeaker, which has a diaphragm deflectable along a Z axis for generating sound waves in the audible wavelength range and disposed with respect to the opening of the second circuit board cavity so that the second circuit board cavity forms at least a part of a cavity of the MEMS loudspeaker;
- an ASIC, which is disposed in the first circuit board cavity of the printed circuit board and completely integrated into the printed circuit board and electrically connected to the MEMS loudspeaker;
- and
- wherein the printed circuit board defines at least one pressure equalization channel, which is integrated therein and extends, starting from the second circuit board cavity, up to the outer face of the printed circuit board and defines an opening in the outer face.
Dependencies are inferred from the claim text.