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US 10,097,918 B2Granted
Chip arrangement and a method for manufacturing the same
AssigneeInfineon Technologies AG
InventorsThomas Spoettl, Horst Theuss
Life of this patent
Estimating the term…
Abstract
In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.
Claims24
A method for manufacturing a chip arrangement, the method comprising:
- bonding a microphone chip to a first carrier, the microphone chip comprising a microphone structure;
- depositing a conductive adhesive material substantially along the entirety of a second carrier and a cavity of the second carrier;
- and
- arranging the first carrier over the second carrier to where the microphone chip is arranged into the cavity of the second carrier such that the conductive adhesive material couples the first carrier to the second carrier, and wherein the microphone chip is disposed on a side of the first carrier facing the second carrier;
- and
- arranging a second chip into the cavity of the second carrier, and wherein the second chip is disposed on the side of the first carrier facing the second carrier.
3 more elements
A chip arrangement, comprising:
- a first carrier;
- a microphone chip bonded to the first carrier, the microphone chip comprising a microphone structure;
- wherein the first carrier is disposed over the microphone chip;
- a conductive adhesive material disposed substantially along the entirety of a cavity of a second carrier and a cavity of the second carrier;
- and
- a second chip bonded to the first carrier;
- wherein the first carrier is disposed over the second chip;
- and
- wherein the microphone chip is arranged in the cavity of the second carrier such that the conductive adhesive material couples the first carrier to the second carrier, and wherein the microphone chip and the second chip are disposed on a side of the first carrier facing the second carrier.
6 more elements
Dependencies are inferred from the claim text.