Method and apparatus for chip-on board flexible light emitting diode

A lighting device, comprising:

• a plurality of coplanar LED chips mounted on a continuous planar flexible substrate, wherein the continuous planar flexible substrate is disposed in an arcuate orientation having a hollow center and wherein each of the plurality of LED chips is powered by a single power source;
• wherein the continuous planar flexible substrate comprises an inner diameter and an outer diameter, the plurality of coplanar LED chips being mounted between the inner diameter and outer diameter of the continuous planar flexible substrate;
• a continuous electrical connection line disposed about the continuous planar flexible substrate between each of the plurality of coplanar LED chips;
• a luminescent coating disposed about a surface of the arcuate continuous planar flexible substrate forming an encapsulating layer about a top surface of the arcuate substrate;
• a stiffener disposed behind the plurality of LED chips about a back surface of the flexible substrate;
• and
• a power source coupled to the electrical connection line.

A method of manufacturing a lighting device, comprising:

• (a) disposing an intermediate plate atop a base plate, wherein the base plate comprises guide posts that correspond to alignment holes placed within the intermediate plate;
• (b) disposing a flexible substrate assembly atop the intermediate plate, the flexible substrate assembly comprising alignment holes for placement about guide posts of the base plate and further comprising a plurality of rectangular flexible substrate strips removable from the flexible substrate assembly, wherein each of the flexible substrate strips comprises a plurality of wire bonding pads configured to receive a LED chip thereon;
• (c) disposing a magnetic top plate atop the flexible substrate, the magnetic top plate comprising alignment holes corresponding to the guide posts disposed within the base plate, wherein the magnetic top plate further comprises apertures corresponding to at least the wire bonding pads;
• and
• (d) securing a plurality of LED chips about each one of the plurality of flexible substrate strips.

A lighting device, comprising:

• a plurality of LED chips mounted on a continuous planar flexible substrate, wherein the continuous planar flexible substrate is disposed in an arcuate orientation having a hollow center, wherein a first plurality of LED chips mounted on a first arcuate substrate comprises a first lighting sub-assembly and a second plurality of LED chips comprises a second lighting sub-assembly;
• wherein each of the plurality of LEDs comprises an optical axis that is normal to the continuous planar flexible substrate and wherein the optical axes of the plurality of LEDs are parallel;
• a continuous heat sink having an arcuate surface shaped to approximate the arcuate orientation of the continuous planar flexible substrate and coupled to the flexible substrate between a face of the continuous heat sink and a back of the continuous planar flexible substrate;
• and
• a power source coupled to the plurality of LED chips.

A lighting device, comprising:

• a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation and wherein each of the plurality of LED chips is powered by a single power source, wherein the planar flexible substrate is shaped to approximate a ring with an opening through one side of the ring, wherein opposing sides of the opening through the ring define a wedge-shaped opening;
• a heat sink having an arcuate surface shaped to approximate the arcuate orientation of the single planar flexible substrate and coupled to the flexible substrate;
• and
• a power source coupled to the plurality of LED chips.

A light device, comprising:

• a plurality of LED chips mounted on a U-shaped planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation and wherein each of the plurality of LED chips is powered by a single power source;
• a heat sink having an arcuate surface shaped to approximate the arcuate orientation of the single planar flexible substrate and coupled to the flexible substrate, wherein the planar substrate is disposed about a cylindrical heat sink and wherein side portions of the U-shaped substrate are disposed on opposing sides of the sink;
• and
• a power source coupled to the plurality of LED chips.

A lighting device mounted in a hand-held flashlight, comprising:

• a plurality of coplanar LED chips mounted on the face of a continuous planar substrate, wherein the continuous planar substrate is disposed in an arcuate orientation forming a ring with a hollow center wherein the plurality of coplanar LED chips have an optical axis parallel with an imaginary axis passing through the center of the ring;
• a continuous heat sink having an arcuate surface shaped to approximate the arcuate orientation of the planar substrate, wherein a face of the heat sink is abutting a back side of the continuous planar substrate;
• a coating disposed about a top surface of the arcuate planar substrate;
• a tab extending from a lateral side of the substrate, said tab comprising an electrical coupling for coupling to a power source;
• and
• a power source coupled to the plurality of LED chips.