Packaged semiconductor devices with wireless charging means
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Ming-Hung Tseng, Hung-Yi Kuo
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Abstract
A method for packaging a semiconductor device used in an electronic apparatus having wireless charging function is provided. The method includes coupling a semiconductor device and a coil over a redistribution layer. The method further includes forming a molding material over the semiconductor device and the coil. The method also includes forming a conductive metal slot over the molding material. An opening is formed on the conductive metal slot for allowing magnetic flux to pass through.
Claims20
A semiconductor device package, comprising:
- a semiconductor device;
- a coil surrounding an axis and configured to produce electric current as magnetic flux passes through the coil;
- a molding material surrounding the semiconductor device and the coil;
- and
- a conductive metal slot positioned over the molding material and comprising a plurality of sub-portions arranged around the axis.
An electronic apparatus, comprising;
- a housing;
- a semiconductor device positioned in the housing;
- a coil positioned in the housing and arranged adjacent to the semiconductor device, wherein the coil is configured to produce electric current as magnetic flux passes through the coil;
- and
- a conductive metal slot positioned in the housing and arranged with the coil along an axis, wherein an opening is formed on the conductive metal slot, and at least one channel is formed on the conductive metal slot and connects the opening to the edge of the conductive metal slot.
A semiconductor device package, comprising:
- a semiconductor device;
- a coil surrounding an axis and configured to produce electric current as magnetic flux passes through the coil;
- a molding material surrounding the semiconductor device and the coil;
- and
- a conductive metal slot positioned over the molding material and comprising two sub-portions arranged symmetrical relative to the axis.
Dependencies are inferred from the claim text.