Interface apparatus for semiconductor testing and method of manufacturing same

A method of manufacturing an interface apparatus, said method comprising:

• drilling a first plurality of apertures through a first housing substrate, said first plurality of apertures arranged according to a first pitch;
• forming a recessed portion in a second housing substrate;
• drilling a second plurality of apertures through said second housing substrate, said second plurality of apertures arranged according to a second pitch;
• drilling a plurality of injection holes (being disposed) between boundaries of said recessed portion and a periphery of said second plurality of apertures;
• passing a plurality of wires through said first and second plurality of apertures;
• attaching said first housing substrate to said second housing substrate thereby forming a housing;
• and
• cutting a wire ends protruding out from said first and said second housing substrates,
• wherein said first plurality of apertures corresponds to said second plurality of apertures, and wherein said first pitch is less than said second pitch.