Coil module
AssigneeMurata Manufacturing Co., Ltd.
InventorShinichiro Banba
Life of this patent
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Abstract
A coil module includes a substrate layer, a coil electrode, and a sealing resin layer. The coil electrode includes metal pins that stand on a resin substrate of the substrate layer in such a way that lower end surfaces thereof are exposed on a lower surface of the substrate layer. The sealing resin layer is stacked on the substrate layer and covers the metal pins. Upper end surfaces of the metal pins are exposed on an upper surface of the sealing resin layer. Each of the metal pins and a corresponding one of the metal pins paired therewith are connected to each other on the lower surface of the substrate layer through a lower wiring pattern. Each of the pins and a corresponding one of the metal pins are connected to each other on the upper surface of the substrate layer through an upper wiring pattern.
Claims23
A coil module comprising:
- a substrate layer having a first main surface and a second main surface facing opposite directions, the substrate layer including a wiring substrate and a resin substrate arranged adjacent to each other that define the first main surface of the substrate layer;
- a coil electrode including a plurality of columnar conductors, wherein each of the columnar conductors extends through the resin substrate in such a way that a first end each of the columnar conductors is exposed on the first main surface of the substrate layer;
- and
- a sealing resin layer stacked on the second main surface of the substrate layer that covers the columnar conductors, the sealing resin layer having a stacking surface that faces the second main surface of the substrate layer,
- wherein a second end of each of the columnar conductors is exposed on an opposite surface of the sealing resin layer opposite to the stacking surface of the sealing resin layer
- wherein each of the columnar conductors and a corresponding one of the columnar conductors are paired and connected to each other on the first main surface of the substrate layer through a first conductive layer, and
- wherein each of the columnar conductors and a corresponding one of the columnar conductors are paired and connected to each other on the opposite surface of the sealing resin layer through a second conductive layer.
Dependencies are inferred from the claim text.