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US 10,096,891 B2Granted
Wireless antenna array system architecture and methods to achieve 3D beam coverage
AssigneeIntel Corporation
InventorsDebabani Choudhury, Richard D. Roberts, Ulun Karacaoglu
Life of this patent
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Abstract
Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
Claims26
A multilayer package for high frequency communications, comprising:
- a plurality of patch antennas disposed on a first substrate;
- a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and the third substrate are disposed on opposing sides of a second substrate;
- and
- an integrated circuit coupled to the plurality of Yagi antennas and the plurality of patch antennas.
1 more element
A multilayer package for high frequency communications, comprising:
- a plurality of patch antennas disposed on a first substrate;
- a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate;
- a first interconnect coupling a first patch antenna to an integrated circuit second substrate;
- a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate;
- a third interconnect coupling the integrated circuit to a metal layer of the second substrate;
- a fourth interconnect coupling a first Yagi antenna to the integrated circuit;
- and
- a fifth interconnect coupling a second Yagi antenna to the integrated circuit.
5 more elements
A wireless communication device for high frequency communications comprising:
- a multilayer package, including a plurality of patch antennas disposed on a first substrate and a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate;
- and
- an integrated circuit, wherein each of the plurality of Yagi antennas and each of the plurality of patch antennas are coupled to the integrated circuit.
A method of operating a multilayer package for high frequency communications that is configured to include:
- a plurality of patch antennas disposed on a first substrate and a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate;
- a first interconnect coupling a first patch antenna to an integrated circuit through the second substrate, a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate, a third interconnect coupling the integrated circuit to a metal layer of the second substrate, a fourth interconnect coupling a first Yagi antenna to the integrated circuit, and a fifth interconnect coupling a second Yagi antenna to the integrated circuit, the method comprising:
- transmitting, by the integrated circuit, signals to the first patch antenna through the first interconnect and receiving signals from the second patch antenna through the second interconnect;
- and
- transmitting signals, by the integrated circuit, to the first Yagi antenna through the fourth interconnect and receiving signals from the second Yagi antenna through the fifth interconnect.
2 more elements
Dependencies are inferred from the claim text.