Back to results
US 10,096,793 B2Granted
Package for device to be packaged, manufacturing method thereof, and OLED apparatus comprising the package
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Optoelectronics Technology Co., Ltd.
InventorsYujing Cao, Song Song
Life of this patent
Estimating the term…
Abstract
A package is provided. The package includes a base substrate includes a first surface, a second surface opposite the first surface, and a side face, wherein a device to be packaged is formed on the first surface, and a packaging cover-plate surrounding the first surface of the base substrate and directly coupled to at least one of the side face and the second surface of the base substrate, wherein the device to be packaged is formed in an enclosure space defined by the packaging cover-plate and the base substrate.
Claims6
A package, comprising:
- a base substrate comprising a first surface, a second surface opposite the first surface, and a side face, wherein a device to be packaged is formed on the first surface;
- and
- a packaging cover-plate surrounding the first surface of the base substrate wherein the device to be packaged is formed in a first enclosure space defined by the packaging cover-plate and the base substrate, wherein the packaging cover-plate is directly coupled to the second surface of the base substrate, and wherein a second enclosure space, which is defined by the base substrate, the packaging cover-plate and the device to be packaged, is filled with at least one of a water-absorbing material and an oxygen-absorbing material wherein the package further comprises a packaging film in the first enclosure space, wherein the packaging film is directly coupled to the first surface of the base substrate, and wherein the device to be packaged is encapsulated by the packaging film and the base substrate.
Dependencies are inferred from the claim text.