Silicone resin film, curable silicone resin composition, optical semiconductor device, and packaging method for optical semiconductor device

A silicone resin film, comprising

• a release substrate;
• and
• a silicone resin coating layer coated on the release substrate, wherein the coating layer is formed by coating a curable silicone resin composition on the release substrate and cured, wherein the curable silicone resin composition comprises:
• 10 to 25 parts by weight of a linear polysiloxane, the average composition formula of the linear polysiloxane having at least one aryl group bonded to a silicon atom and two alkenyl groups bonded to a silicon atom;
• 40 to 55 parts by weight of a first silicone resin, wherein the average composition formula of the first silicone resin comprises at least a R1SiO3/2 unit and a R22SiO2/2 unit, wherein R1 and R2 are independently substituted or unsubstituted alkyl groups, substituted or unsubstituted alkenyl groups or substituted or unsubstituted aryl groups, the molar fraction of R1SiO3/2 unit is between 0.60 to 0.75 in the average composition formula of the first silicone resin, the molar ratio of the alkenyl groups bonded to the silicon atoms to all the functional groups bonded to silicon atoms is between 0.03 to 0.15;
• 15 to 30 parts by weight of a second silicone resin, wherein the average composition formula of the second silicone resin comprises at least a R3SiO3/2 unit and R43SiO1/2 unit, wherein R3 and R4 independently are substituted or unsubstituted alkyl groups, substituted or unsubstituted alkenyl groups or substituted or unsubstituted aryl groups;
• 15 to 25 parts by weight of polysiloxane having silicon-hydrogen bonding of the formula:
• HR52SiO(SiR62O)nSiR52H, wherein R5 is a substituted or unsubstituted alkyl group or hydrogen, R6 is a substituted or unsubstituted aryl group, or a substituted or unsubstituted alkyl group, n is an integer more than 0;
• a platinum group metal catalyst;
• and
• a phosphor compound.