Lumen maintenance factor deterioration suppressing LED module

A light-emitting diode (LED) module, comprising:

• a substrate;
• a metal layer disposed above the substrate;
• a resist layer disposed above the substrate and including a plurality of layers;
• an LED chip mounted above the substrate;
• and
• a wire connecting the metal layer and the LED chip,
• wherein, in a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate, and the LED chip is mounted above the resist layer via an adhesive that is white, and
• in a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate, and the resist layer is disposed above the metal layer.

A light-emitting diode (LED) module, comprising:

• a substrate;
• a metal layer disposed above the substrate;
• a resist layer comprising an epoxy acrylic based resin that is disposed above the substrate and including a plurality of layers;
• an LED chip mounted above the substrate;
• and
• a wire connecting the metal layer and the LED chip,
• wherein, in a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate, and the LED chip is mounted above the resist layer via an adhesive, and
• in a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate, and the resist layer is disposed above the metal layer.