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US 10,096,724 B2Granted
Radiation detector comprising a compensating sensor
AssigneeMelexis Technologies SA
InventorsCarl Van Buggenhout, Appolonius Jacobus Van Der Wiel, Luc Buydens
Life of this patent
Estimating the term…
Abstract
A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
Claims16
A chip for radiation measurements, the chip comprising
- a first substrate comprising at least a first sensor and a second sensor,
- a second substrate comprising at least a first cavity and a second cavity both with oblique walls,
- wherein an internal layer is present on the inside of the second cavity, the internal layer being configured to attenuate incoming radiation by more than 10 dB before it reaches the second sensor, and
- wherein the second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
1 more element
A chip comprising:
- a first substrate that includes a first sensor and a second sensor
- wherein the first sensor is configured to sense incoming radiation and the second sensor is a reference sensor;
- and
- a second substrate coupled to the first substrate, the second substrate defining a first cavity and a second cavity;
- wherein the first cavity is arranged above the first sensor, the first cavity being defined at least by first sidewalls, the first sidewalls including first oblique sidewalls;
- wherein the second cavity is arranged above the second sensor, the second cavity being defined at least by second sidewalls, the second sidewalls including second oblique sidewalls;
- wherein the chip further includes an internal layer arranged on an inside portion of the second cavity, and
- the internal layer is configured to attenuate incoming radiation by more than 10 dB before it reaches the second sensor.
5 more elements
Dependencies are inferred from the claim text.