Power semiconductor device comprising trench structures
AssigneeMagnaChip Semiconductor, Ltd.
InventorsKwang Ho Na, Seung Wook Song, Yong Hun Kim
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AssigneeMagnaChip Semiconductor, Ltd.
InventorsKwang Ho Na, Seung Wook Song, Yong Hun Kim
Estimating the term…
A power semiconductor device includes a semiconductor substrate, trench structures comprising a first, a second, a third and a fourth trench structure formed in the substrate, a second conductivity type body region formed between the trench structures, a first conductivity type source region formed in the second conductivity type body region, and an emitter electrode and a gate pad formed over the substrate, wherein each trench structure includes a top electrode and a bottom electrode, and each top electrode is insulated from the corresponding bottom electrode, and wherein the first trench structure is symmetric to the fourth trench structure, and the second trench structure is symmetric to the third trench structure, and wherein the first trench structure is not identical to the second trench structure, and wherein no first conductivity type source region is formed to be adjacent to the second trench structure and the third trench structure.
A power semiconductor device, comprising:
A power semiconductor device, comprising:
Dependencies are inferred from the claim text.