Semiconductor unit, method of manufacturing the same, and electronic apparatus
AssigneeSony Corporation
InventorHironobu Abe
Life of this patent
Estimating the term…
Abstract
There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.
Claims12
A method for manufacturing a semiconductor device, comprising:
- providing a flexible device substrate;
- forming a thin film transistor (TFT) layer on the device substrate, the TFT layer including a plurality of TFTs and a plurality of electrical electrodes connected to the TFTs, wherein the electrical electrodes are formed on a first side of the device substrate;
- attaching a first wiring substrate to the flexible device substrate such that the first wiring substrate is electrically connected to the eletrical electrodes on the first side of the device substrate;
- attaching a second wiring substrate to the first wiring substrate such that the second wiring substrate is electrically connected to the electrical electrodes via the first wiring substrate, wherein the second wiring substrate includes a first surface with first wirings and a second surface with second wirings, wherein a first drive circuit is connected to the second surface of the second wiring substrate, and wherein a portion of the second wiring substrate is between the first drive circuit and a second side of the device substrate.
A semiconductor device, comprising:
- a flexible device substrate;
- a plurality of electrodes on a first surface side of the device substrate;
- a first wiring substrate, including first wirings on a first surface, wherein the first wirings are connected to the electrodes, and wherein a portion of the first surface of the first wiring substrate is in contact with a portion of the first surface of the device substrate;
- a second wiring substrate, including:
- first wirings on a first surface;
- second wirings on a second surface;
- and
- a first drive circuit on the second surface, wherein a portion of the first surface of the second wiring substrate is in contact with a portion of the first surface of the first wiring substrate, wherein the first wirings of the second wiring substrate are electrically connected to the electrodes by the first wirings of the first wiring substrate, and wherein a portion of the second wiring substrate is between the first drive circuit and a second surface side of the device substrate.
Dependencies are inferred from the claim text.