Method and apparatus for image sensor packaging

A method comprising:

• forming a sensor device comprising:
• a substrate;
• a first pixel in the substrate;
• a first dielectric layer over a major surface of the substrate;
• a first bond pad in the first dielectric layer and electrically connected to the first pixel;
• and
• a first dummy pad in the first dielectric layer;
• and
• bonding an application specific integrated circuit (ASIC) chip to the sensor device, wherein bonding the ASIC chip to the sensor device comprises:
• contacting a second dielectric layer of the ASIC chip to the first dielectric layer;
• contacting a second bond pad in the second dielectric layer to the first bond pad;
• and
• contacting the second dielectric layer to the first dummy pad.

A method comprising:

• providing a first die comprising:
• a column of pixels in a substrate;
• a first dielectric layer over a front surface of the substrate;
• a first bond pad in the first dielectric layer and electrically connected to a plurality of pixels in the column of pixels;
• and
• a plurality of dummy pads in the first dielectric layer, wherein a cumulative surface area of all dummy pads in the first dielectric layer is less than about forty percent of a surface area of the front surface of the substrate;
• and
• hybrid bonding a second die to the first die, wherein hybrid bonding the second die to the first die comprises:
• contacting a second dielectric layer to the first dielectric layer;
• and
• contacting a second bond pad to the first bond pad.