Fingerprint recognition chip packaging structure and packaging method

A packaging method for forming a packaging structure for a fingerprint identification chip, wherein the packaging structure comprises a substrate, a sensing chip, a wire and a plastic encapsulation layer, and the packaging method comprises:

• providing the substrate, wherein the substrate has a substrate surface, and the substrate surface is provided with a first solder pad layer;
• fixing the sensing chip on the substrate surface, wherein the sensing chip has a first surface and a second surface arranged opposite to the first surface, the second surface of the sensing chip is arranged on the substrate surface, the first surface of the sensing chip comprises a sensing area and a peripheral area surrounding the sensing area, and the surface of the sensing chip in the peripheral area is provided with a second solder pad layer, the number of the first solder pad layers is the same as the number of the second solder pad layers, a position of the first solder pad layer has a one-to-one correspondence with a position of the second solder pad layer;
• forming the wire, wherein two ends of the wire are electrically connected to the first solder pad layer and the second solder pad layer respectively, a point of the wire farthest away from the substrate surface is a vertex, and a distance from the vertex to the first surface of the sensing chip is a first distance;
• forming the plastic encapsulation layer on the substrate surface and the first surface of the sensing chip, wherein the plastic encapsulation layer is made of a polymer, the plastic encapsulation layer surrounds the wire and the sensing chip, a surface of the plastic encapsulation layer on the sensing area is flat, a distance from the surface of the plastic encapsulation layer to the first surface of the sensing chip is a second distance, and the second distance is greater than the first distance;
• forming a groove in the plastic encapsulation layer around the sensing area, wherein the groove is exposed from a side wall of the plastic encapsulation layer;
• and
• forming a protecting ring on the substrate surface around the plastic encapsulation layer, the wire and the sensing chip, wherein part of the protecting ring is arranged on a surface of the plastic encapsulation layer, the plastic encapsulation layer on a surface of the sensing area of the sensing chip is at least exposed from the protecting ring, and the part of the protecting ring arranged on the surface of the plastic encapsulation layer is arranged in the groove.