Bump structures for interconnecting focal plane arrays

A method of forming bump structures for interconnecting components, comprising:

• dry etching a layer of insulating material to create a pattern for bump structures;
• depositing a seed layer on the insulating material over the pattern;
• patterning the seed layer with a photo resist material;
• forming bump structures over the seed layer and the photo resist material with a plating material in the pattern, wherein the bump structures are isolated from one another;
• removing the photo resist material after forming the bump structures over the seed layer and
• the photo resist material, wherein removing the photo resist material includes leaving the bump structures seated in a seat of the seed layer, wherein the seed layer is recessed below the insulating material to provide a gap between the bump structures and the insulating material, wherein dry etching the layer of insulating material includes dry etching a dielectric layer deposited on the insulating material, and an initial layer of photo resist material deposited on the dielectric layer, patterning the initial layer of photoresist material, and dry etching the initial layer of photo resist material, the dielectric layer, and the insulating material to create the pattern for bump structures, wherein the gap between the bump structures and the insulating material is also between the dielectric layer and the bump structures.