Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer

A method of manufacturing a light emitting element, the method comprising:

• forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer comprising a transparent board and a plurality of light emitting parts formed on the transparent board;
• forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film;
• cutting the resin film along the scheduled separation surface before forming the scribing line such that, after the cutting of the resin film, a portion of the transparent board remains along the scheduled separation surface;
• and
• separating the transparent board along the scheduled separation surface by breaking the remaining portion of the transparent board after forming the scribing line and cutting the resin film.

A method of manufacturing a light emitting element, the method comprising:

• forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer comprising a transparent board and a plurality of light emitting parts formed on the transparent board;
• forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film;
• cutting the resin film along the scheduled separation surface before or after forming the scribing line such that, after the cutting of the resin film, a portion of the transparent board remains along the scheduled separation surface;
• and
• separating the transparent board along the scheduled separation surface by breaking the remaining portion of the transparent board after forming the scribing line and cutting the resin film;
• and
• forming a white sidewall that covers a side surface of the flip-chip mounted light emitting element.