Enhanced power distribution to application specific integrated circuits (ASICS)
AssigneeCisco Technology, Inc.
InventorsPaul L. Mantiply, Straty Argyrakis
Life of this patent
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Abstract
Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.
Claims20
An apparatus comprising:
- a substrate with a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side;
- an application-specific integrated circuit (ASIC) mounted on the first side of the substrate, in alignment with the via, with a ball grid array (BGA) associated with the via that includes a depopulated central section;
- and
- a voltage regulator module mounted on the second side of the substrate in alignment with the via so that the voltage regulator is electrically coupled to the ASIC through the via, wherein the depopulated central section of the BGA allows signals and input power to be delivered to the voltage regulator module.
An apparatus comprising:
- a printed circuit board (PCB) with a preexisting vertical interconnect access (via);
- and
- a voltage regulator module integrated into the PCB in a shadow of an application-specific integrated circuit (ASIC) that is aligned with the preexisting via, wherein the ASIC is mounted to the PCB with a ball grid array (BGA) that is associated with the preexisting via and that includes a depopulated central section that allows signals and input power to be delivered to the voltage regulator module.
An apparatus comprising:
- a substrate with a first side and a second side;
- an application-specific integrated circuit (ASIC) mounted on the first side of the substrate with a ball grid array (BGA) that includes a depopulated central section;
- and
- a voltage regulator module mounted on the second side of the substrate in alignment with the ASIC, the voltage regulator module being electrically coupled to the ASIC through the substrate, wherein the depopulated central section of the BGA allows signals and input power to be delivered to the voltage regulator module.
Dependencies are inferred from the claim text.