Illumination assembly, method of manufacturing the Illumination assembly, and backlight module including the illumination assembly
AssigneeTaiwan Green Point Enterprises Co., Ltd.
InventorsYu-Chuan Lin, Pen-Yi Liao, Hui-Ching Chuang, Chih-Hao Chen, Ai-Ling Lin
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Abstract
An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.
Claims5
A method of manufacturing an illumination assembly, comprising the following steps:
- providing a substrate;
- forming on the substrate a catalyst layer that covers a part of the substrate;
- forming a first conducting layer on the catalyst layer by an electroless plating technique;
- forming a reflecting layer on another part of the substrate exposed from the first conducting layer and on lateral sides of the catalyst layer and the first conducting layer;
- and
- disposing a plurality of light-emitting diodes on the first conducting layer so as to electrically connect the plurality of light-emitting diodes to the first conducting layer,
- wherein a part of the reflecting layer, which is formed on the lateral sides of the catalyst layer and the first conducting layer, is located underneath the light-emitting diodes.
Dependencies are inferred from the claim text.