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US 10,096,578 B1Granted
Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChang-Lin Yeh, Yu-Chang Chen
Life of this patent
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Abstract
A semiconductor package device includes a substrate, an electronic component disposed on the substrate, and a package body. The electronic component has a first surface adjacent to the substrate and a second surface opposite to the first surface. The second surface has at least five edges, and the package body encapsulates the electronic component and exposes the second surface of the electronic component.
Claims23
A semiconductor package device, comprising:
- a substrate;
- an electronic component disposed on the substrate, the electronic component having a first surface adjacent to the substrate and a second surface opposite to the first surface, wherein the second surface has at least five edges;
- and
- a package body encapsulating the electronic component and exposing the second surface of the electronic component.
1 more element
A semiconductor package device, comprising:
- a substrate;
- an electronic component disposed on the substrate, the electronic component having a first surface adjacent to the substrate and a second surface opposite to the first surface, wherein at least one angle defined by two adjacent edges of the second surface of the electronic component is greater than about 90 degrees;
- and
- a package body encapsulating the electronic component and exposing the second surface of the electronic component.
1 more element
Dependencies are inferred from the claim text.