Semiconductor device assemblies with annular interposers
AssigneeMicron Technology, Inc.
InventorThomas H. Kinsley
Life of this patent
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Abstract
A semiconductor device package is provided. The package can include a stack of semiconductor dies over a substrate, the substrate including a plurality of electrical contacts, and an annular interposer disposed over the substrate and surrounding the stack of semiconductor dies. The annular interposer can include a plurality of circuit elements each electrically coupled to at least a corresponding one of the plurality of electrical contacts. The package can further include a lid disposed over the annular interposer and the stack of semiconductor dies.
Claims17
A semiconductor device package, comprising:
- a stack of semiconductor dies over a substrate;
- the substrate including a plurality of electrical contacts;
- an annular interposer disposed over the substrate and surrounding the stack of semiconductor dies, the annular interposer including a plurality of circuit elements each electrically coupled to at least a corresponding one of the plurality of electrical contacts;
- and
- a lid disposed over the annular interposer and the stack of semiconductor dies,
- wherein the plurality of circuit elements extend upwardly from an upper surface of the annular interposer, and
- wherein the lid includes recesses in a lower surface thereof to accommodate the plurality of circuit elements.
A semiconductor device assembly, comprising:
- a substrate having an upper surface with a plurality of electrical contacts thereon;
- a stack of semiconductor dies disposed over the upper surface of the substrate, the stack of semiconductor dies extending above the upper surface of the substrate by a first height;
- a first plurality of circuit elements disposed over the upper surface of the substrate peripherally to the stack of semiconductor dies, the plurality of circuit elements extending above the upper surface of the substrate by a second height less than the first height;
- an annular interposer disposed over the plurality of circuit elements, the annular interposer including an opening through which the stack of semiconductor dies extends, the annular interposer further including a second plurality of circuit elements, each of the second plurality of circuit elements being electrically coupled to at least one of the plurality of electrical contacts;
- and
- a lid disposed over both the stack of semiconductor dies and the annular interposer,
- wherein the second plurality of circuit elements extend upwardly from an upper surface of the annular interposer, and
- wherein the lid includes recesses in a lower surface thereof to accommodate the second plurality of circuit elements.
Dependencies are inferred from the claim text.