Package substrate and package
AssigneeWinbond Electronics Corp.
InventorYu-Ming Chen
Life of this patent
Estimating the term…
Abstract
A package substrate including a carrier, a first patterned conductive layer, a second patterned conductive layer and a 3D-printing conductive wire is provided. The carrier has a first surface, a second surface and a third surface. The first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface. The second patterned conductive layer is disposed on the second surface. The 3D-printing conductive wire is disposed on the third surface and connected between the first patterned conductive layer and the second patterned conductive layer.
Claims10
A package substrate, comprising:
- a carrier, having a first surface, a second surface and a third surface, wherein the first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface;
- a first patterned conductive layer, disposed on the first surface;
- a second patterned conductive layer, disposed on the second surface;
- and
- a three-dimensional (3D) printing conductive wire, disposed on the third surface and connected between the first patterned conductive layer and the second patterned conductive layer.
A package, comprising:
- a package substrate, comprising:
- a carrier, having a first surface, a second surface and a third surface, wherein the first surface is opposite to the second surface, and the third surface is connected between the first surface and the second surface;
- a first patterned conductive layer, disposed on the first surface;
- a second patterned conductive layer, disposed on the second surface;
- and
- a 3D-printing conductive wire, disposed on the third surface and connected between the first patterned conductive layer and the second patterned conductive layer;
- and
- a first electronic device, disposed on the first surface and electrically connected with the first patterned conductive layer.
Dependencies are inferred from the claim text.