Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYuki Hata, Shintaro Araki, Takaaki Shirasawa
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Abstract
A semiconductor device includes a semiconductor module having a semiconductor element, a radiator plate which is connected to the semiconductor element and which has at least one radiator plate through hole formed therein, and resin covering the semiconductor element and the radiator plate with a lower surface of the radiator plate exposed, a cooler, first insulating grease provided between the lower surface of the radiator plate and the cooler to thermally connect the radiator plate and the cooler, and second insulating grease provided in the at least one radiator plate through hole to be connected to the first insulating grease.
Claims10
A semiconductor device comprising:
- a semiconductor module comprising a semiconductor element, a radiator plate which is connected to the semiconductor element and which has at least one radiator plate through hole formed therein, and a resin covering the semiconductor element and the radiator plate with a lower surface of the radiator plate exposed;
- a cooler;
- a first insulating grease provided between the lower surface of the radiator plate and the cooler to thermally connect the radiator plate and the cooler;
- and
- a second insulating grease provided in the at least one radiator plate through hole such that the second insulating grease is in direct contact with the first insulating grease.
Dependencies are inferred from the claim text.