Manufacturing method of semiconductor package
AssigneeJ-Devices Corporation
InventorsToshiyuki Inaoka, Atsuhiro Uratsuji
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Abstract
A manufacturing method of a semiconductor package includes locating, on a substrate, a semiconductor device having an external terminal provided on a top surface thereof, forming a resin insulating layer covering the semiconductor device, forming an opening, exposing the external terminal, in the resin insulating layer, performing plasma treatment on a bottom surface of the opening, performing chemical treatment on the bottom surface of the opening after the plasma treatment, and forming a conductive body to be connected with the external terminal exposed in the opening.
Claims20
A manufacturing method of a semiconductor package, comprising:
- roughening a side surface and a rear surface of a substrate;
- locating, on the substrate, a semiconductor device having an external terminal provided on a top surface thereof;
- forming a resin insulating layer covering the semiconductor device;
- forming a conductive layer on the resin insulating layer;
- roughening a surface of the conductive layer;
- forming an opening, exposing the external terminal, in the conductive layer with the roughened surface and the resin insulating layer;
- removing the roughened surface of the conductive layer after forming the opening;
- performing a plasma treatment on a bottom surface of the opening;
- performing a chemical treatment on the bottom surface of the opening after the plasma treatment;
- and
- forming a conductive plating layer on the side surface of the substrate, the rear surface of the substrate and the surface of the conductive layer after removing the roughened surface of the conductive layer, the conductive plating layer being connected with the external terminal exposed in the opening.
Dependencies are inferred from the claim text.