Integrated circuit die having a split solder pad
AssigneeEM Microelectronic-Marin SA
InventorsChristoph Kuratli, Yves Dupraz
Life of this patent
Estimating the term…
Abstract
An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.
Claims9
An integrated circuit die comprising:
- at least two bond pads
- a redistribution layer, said redistribution layer comprising:
- at least one solder pad comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on said solder pad, but electrically isolated from each other in the absence of a solder ball on the solder pad,
- at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.
An integrated circuit comprising:
- at least two bond pads;
- at least one solder pad comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated from each other in the absence of a solder ball on the solder pad;
- a first wire connecting a first one of the at least two bond pads to a first portion of the solder pad;
- a second wire connecting a second one of the at least two bond pads to a second portion of the solder pad;
- a circuit board with at least one wire bond contact;
- a third wire connected between the wire bond contact and the first one of the two bond pads;
- and
- a fourth wire connected between the wire bond contact and the second one of the two bond pads.
Dependencies are inferred from the claim text.