Multi-band antenna package structure, manufacturing method thereof and communication device

A method for manufacturing a multi-band antenna package structure, comprising:

• providing a first temporary substrate with a first glue layer;
• forming a first dielectric material layer on the first glue layer, and forming first metal patterns in openings of the first dielectric material layer;
• forming at least one metal via on one of the first metal patterns;
• forming at least one metal pillar on portions of the first metal patterns, and disposing an integrated circuit chip on the metal pillar;
• a molding layer is formed to cover the metal pillar, the metal via and the integrated circuit chip;
• thinning down the molding layer to expose the metal via, so as to form an integrated circuit chip layer comprising the molding layer, the metal via, the metal pillar and the integrated circuit chip;
• forming a first redistribution layer on the integrated circuit chip layer, wherein the first redistribution layer comprises a second dielectric material layer and second metal patterns, wherein the second patterns are formed in opening of the second dielectric material layer;
• forming a first antenna unit layer on the first redistribution layer, wherein the first antenna unit layer comprises a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit;
• forming a first protection layer on the first antenna unit layer, such that a first stacked structure is formed;
• removing the first temporary substrate with the first glue layer, and facing down the first stacked structure to adhere the first stacked structure on a second temporary substrate with a second glue layer;
• forming a second redistribution layer by processing the first dielectric material layer and the first metal patterns, wherein the second redistribution layer comprising the processed first dielectric material layer and the processed first metal patterns;
• forming a second protection layer on the second redistribution layer;
• forming bump balls on the second protection layer, such that a second stacked structure is formed;
• and
• removing the second temporary substrate with the second glue layer, facing down the second stacked structure, and mounting the second stacked structure on a substrate through the bump balls;
• wherein the first antenna unit is a multiple input multiple output phase antenna, and the integrated circuit chip has a height the same as that of the metal via, or alternatively less than that of the metal via.

A communication device, comprising:

• a multi-band antenna package structure, comprising:
• a first redistribution layer, comprising a first dielectric material layer and first metal patterns formed in openings of the first dielectric material layer;
• an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns, and the metal pillar is electrically connected to the integrated circuit chip and one of the first metal patterns;
• a second redistribution layer, formed on the integrated circuit layer, comprising a second dielectric material layer and second metal patterns formed in openings of the second dielectric material layer, wherein the metal via is electrically connected to one of the second metal patterns;
• and
• a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit;
• wherein the integrated circuit is a processing circuit, and the integrated circuit chip has a second antenna unit on the integrated circuit, or alternatively the integrated circuit chip does not have the second antenna unit, but the multi-band antenna package structure further comprises:
• a second antenna unit layer, comprising a second dielectric layer and fourth metal patterns formed in openings of the second dielectric layer, wherein at least one of the fourth metal patterns is electrically connected to one of the first metal patterns, the fourth metal patterns form a second antenna unit, and the first redistribution layer is formed on the second antenna unit layer
• wherein the first antenna unit is a multiple input multiple output phase antenna, and the integrated circuit chip has a height the same as that of the metal via, or alternatively less than that of the metal via.