Metal pad for laser marking
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsAn-Jhih Su, Hsien-Wei Chen
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, and a plurality of redistribution lines overlying the device die and the molding material. A laser mark pad is coplanar with one of the plurality of redistribution lines, wherein the laser mark pad and the one of the plurality of redistribution layers are formed of the same conductive material. A polymer layer is over the laser mark pad and the plurality of redistribution lines. A tape is attached over the polymer layer. A laser mark penetrates through the tape and the polymer layer. The laser mark extends to a top surface of the laser mark pad.
Claims20
A method comprising:
- forming a first package comprising:
- at least one first dielectric layer;
- a first plurality of redistribution lines in the at least one first dielectric layer;
- a device die over and electrically coupled to the first plurality of redistribution lines;
- an encapsulating material encapsulating the device die;
- a through-via penetrating through the encapsulating material;
- at least one second dielectric layer over the device die;
- a second plurality of redistribution lines in the at least one second dielectric layer, wherein one of the second plurality of redistribution lines is electrically coupled to one of the first plurality of redistribution lines through the through-via;
- and
- a metal pad in the at least one second dielectric layer;
- forming a polymer layer overlying the at least one second dielectric layer;
- attaching a tape over the polymer layer;
- and
- performing a laser marking to form a laser mark in the polymer layer and the tape, with portions of the metal pad exposed to the laser mark.
A method comprising:
- forming a first package comprising:
- a device die;
- an encapsulating material encapsulating the device die;
- a first dielectric layer over the device die and the encapsulating material;
- a first redistribution line and a metal pad over the first dielectric layer;
- and
- a second dielectric layer over the first redistribution line and the metal pad;
- attaching a tape over the second dielectric layer;
- and
- using a laser beam to form a laser mark penetrating through the second dielectric layer and the tape, wherein the laser beam stops on the metal pad, and the laser mark has a pattern of a letter or a digit.
A method comprising:
- forming a first package comprising:
- encapsulating a device die and a first metal post in an encapsulating material;
- forming a first dielectric layer over the device die and the encapsulating material;
- forming a plurality of redistribution lines over the first dielectric layer, wherein portions of the plurality of redistribution lines are electrically coupled to the device die;
- forming a metal pad over the first dielectric layer, wherein the metal pad is electrically coupled to the first metal post;
- and
- disposing a second dielectric layer over the plurality of redistribution lines and the metal pad;
- using a laser beam to form a laser mark as an opening penetrating through the second dielectric layer, wherein the laser beam stops on the metal pad, and the laser mark has a pattern of a letter or a digit;
- and
- filling the opening with a dielectric material.
Dependencies are inferred from the claim text.