Semiconductor apparatus, system, and method of manufacturing semiconductor apparatus
AssigneeCanon Kabushiki Kaisha
InventorsAkihiro Kawano, Tsutomu Tange, Masao Ishioka, Koichi Tazoe
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Abstract
There is provided an image capturing apparatus including a pixel circuit that generates a pixel signal based on an electric charge generated by photoelectric conversion and a logic circuit that outputs a signal based on the pixel signal. The image capturing apparatus includes a first contact plug connected to a source or a drain of a first transistor constituting the pixel circuit and a second contact plug connected to a source or a drain of a second transistor constituting the logic circuit. A diameter of the first contact plug is smaller than a diameter of the second contact plug.
Claims19
A semiconductor apparatus comprising:
- a first transistor;
- a first contact plug connected to a source or a drain of the first transistor;
- a second transistor;
- a second contact plug connected to a source or a drain of the second transistor;
- and
- a third contact plug connected to a gate of the second transistor,
- wherein the first transistor constitutes a pixel circuit configured to generate a pixel signal based on an electric charge generated by photoelectric conversion,
- wherein the second transistor constitutes a logic circuit configured to output a signal based on the pixel signal,
- wherein a diameter of the first contact plug is smaller than a diameter of the second contact plug, and
- wherein the diameter of the first contact plug is smaller than a diameter of the third contact plug.
A semiconductor apparatus comprising:
- a first transistor;
- a first contact plug connected to the first transistor;
- a second transistor;
- and
- a second contact plug connected to the second transistor,
- wherein the first contact plug includes a first conductive portion disposed in a first contact hole having a side and a bottom, and a first barrier metal portion including a side portion interposed between the side of the first contact hole and the first conductive portion, and a bottom portion interposed between the bottom of the first contact hole and the first conductive portion of the first contact plug,
- wherein the second contact plug includes a second conductive portion disposed in a second contact hole having a side and a bottom, and a second barrier metal portion including a side portion interposed between the side of the second contact hole and the second conductive portion, and a bottom portion interposed between the bottom of the second contact hole and the second conductive portion,
- wherein a ratio of a thickness of the bottom portion of the first barrier metal portion to a thickness of the side portion of the first barrier metal portion is smaller than a ratio of a thickness of the bottom portion of the second barrier metal portion to a thickness of the side portion of the second barrier metal portion, and
- wherein the thickness of the bottom portion of the second barrier metal portion is larger than the thickness of the bottom portion of the first barrier metal portion.
Dependencies are inferred from the claim text.