Method for fabricating electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChing-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
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Abstract
A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
Claims9
A method for fabricating an electronic package, comprising:
- disposing a plurality of conductive posts in a carrier;
- after disposing the plurality of conductive posts in the carrier, disposing on the carrier a substrate body electrically connected to the conductive posts;
- disposing on the substrate body at least an electronic element electrically connected to the substrate body;
- forming on the substrate body an encapsulant encapsulating the electronic element;
- and
- removing the carrier for the conductive posts to protrude from the substrate body.
Dependencies are inferred from the claim text.