Lead frame and electronic component device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTetsuichiro Kasahara, Naoya Sakai
Life of this patent
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Abstract
A lead frame includes: a resin portion including an upper surface and a lower surface opposite to the upper surface; and a first terminal formed to penetrate the resin portion. The first terminal includes: a first upper terminal portion disposed to protrude from the upper surface; a first lower terminal portion disposed on the first upper terminal portion to protrude from the lower surface; a first through hole formed in one of the first upper terminal portion and the first lower terminal portion; a first recess defined by an inner wall surface of the first through hole and a surface of the other of the first upper terminal portion and the first lower terminal portion; and a first metal layer formed on an inner surface of the first recess.
Claims11
A lead frame comprising:
- a resin portion comprising an upper surface and a lower surface opposite to the upper surface;
- and
- a first terminal formed to penetrate the resin portion,
- wherein the first terminal comprises:
- a first upper terminal portion disposed to protrude from the upper surface;
- a first lower terminal portion disposed on the first upper terminal portion to protrude from the lower surface;
- a first through hole formed in one of the first upper terminal portion and the first lower terminal portion;
- a first recess defined by an inner wall surface of the first through hole and a surface of the other of the first upper terminal portion and the first lower terminal portion;
- and
- a first metal layer formed on an inner surface of the first recess.
An electronic component device comprising:
- a lead frame comprising:
- a resin portion comprising an upper surface and a lower surface opposite to the upper surface;
- and
- a first terminal formed to penetrate the resin portion;
- wherein the first terminal comprises:
- a first upper terminal portion disposed to protrude from the upper surface;
- a first lower terminal portion disposed on the first upper terminal portion to protrude from the lower surface;
- a first through hole formed in one of the first upper terminal portion and the first lower terminal portion;
- a first recess defined by an inner wall surface of the first through hole and a surface of the other of the first upper terminal portion and the first lower terminal portion;
- and
- a first metal layer formed on an inner surface of the first recess, and
- an electronic component mounted on the lead frame to be electrically connected to the first terminal.
Dependencies are inferred from the claim text.