Critical dimension control by use of a photo agent

A method for patterning a substrate, comprising:

• receiving a substrate, the substrate comprising:
• an underlying layer, and
• a patterned layer formed on the underlying layer, the patterned layer comprising radiation-sensitive material and further comprising a pattern of varying elevation and having a first critical dimension;
• applying an overcoat layer over the patterned layer, the overcoat layer comprising a photo agent selected from a photosensitizer generator compound, a photosensitizer compound, a photoacid generator compound, a photoactive agent, an acid-containing compound, or a combination of two or more thereof;
• exposing the overcoat layer to electromagnetic radiation, wherein a dose of electromagnetic radiation applied to different regions of the substrate is varied;
• heating the overcoat layer and patterned layer;
• developing the overcoat layer and the patterned layer to alter the first critical dimension of the patterned layer to a second critical dimension;
• measuring metrology data in an after-develop inspection (ADI) performed after the step of developing the overcoat layer and the patterned layer;
• altering the dose of the electromagnetic radiation applied to different regions of a subsequently-processed substrate during the step of exposing the overcoat layer based on the measured metrology data.

A method for patterning a substrate, comprising:

• receiving a substrate, the substrate comprising:
• an underlying layer, and
• a patterned layer formed on the underlying layer, the patterned layer comprising radiation-sensitive material and further comprising a pattern of varying elevation and having a first critical dimension;
• applying an overcoat layer over the patterned layer, the overcoat layer comprising a photo agent selected from a photosensitizer generator compound, a photosensitizer compound, a photoacid generator compound, a photoactive agent, an acid-containing compound, or a combination of two or more thereof;
• exposing the overcoat layer to electromagnetic radiation, wherein a dose of electromagnetic radiation applied to different regions of the substrate is varied;
• heating the overcoat layer and patterned layer;
• developing the overcoat layer and the patterned layer to alter the first critical dimension of the patterned layer to a second critical dimension;
• etching the underlying layer using the patterned layer having the second critical dimension as a pattern;
• measuring metrology data in an after-etch inspection (AEI) performed after the step of etching the underlying layer;
• and
• altering the dose of the electromagnetic radiation applied to different regions of a subsequently-processed substrate during the step of exposing the overcoat layer based on the measured metrology data.