Wafer processing method

A wafer processing method for dividing a wafer into a plurality of individual device chips along a plurality of crossing division lines formed on a front side of said wafer, the front side of said wafer being partitioned by said division lines to define a plurality of separate regions where a plurality of devices are formed, said individual device chips corresponding to said respective devices, said wafer processing method comprising:

• a frame supporting step of attaching said wafer to an adhesive tape fixed at its peripheral portion to an annular frame, thereby supporting said wafer through said adhesive tape to said annular frame;
• a laser processing step of applying a laser beam to each division line to thereby form a strength reduced portion along each division line;
• and
• a dividing step of applying a radial tension to said adhesive tape and next applying an external force to said wafer in the condition where said radial tension is kept acting on said adhesive tape, thereby dividing said wafer into said individual device chips along said division lines,
• wherein said external force is applied by a metal wedge.