Assembly for handling a semiconductor die and method of handling a semiconductor die

An assembly for handling a semiconductor die, the assembly comprising:

• a carrier with a surface;
• wherein the surface of the carrier comprises a cavity having an electromagnetic source arranged therein;
• an adhesive tape fixed to the surface of the carrier, wherein the adhesive tape is configured to adhere to the semiconductor die;
• the electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die;
• an optical reflector coupled to the electromagnetic source;
• wherein the electromagnetic source is arranged between the carrier and a pepper pot;
• a vacuum generator coupled to the cavity, the vacuum generator configured to generate a suction force for holding the adhesive tape to the surface of the carrier when the semiconductor die is separated from the adhesive tape;
• and
• a die pick-up component configured to pick up the semiconductor die from the adhesive tape.