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US 10,096,507 B2Granted
Thin substrate electrostatic chuck system and method
AssigneeInfineon Technologies AG
InventorsEwald Wiltsche, Peter Zupan
Life of this patent
Estimating the term…
Abstract
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate attached to an electrically insulating carrier; and an AC power supply electrically coupled to the electrostatic chuck.
Claims30
A processing system, comprising:
- an electrostatic chuck configured to hold a workpiece;
- and
- an AC power supply electrically coupled to the electrostatic chuck wherein the AC power supply is configured to provide a first voltage when the workpiece is a first-type workpiece and a second voltage when the workpiece is a second-type workpiece, the first voltage being higher than the second voltage, the first-type workpiece comprising a first semiconductor substrate and an electrically insulating carrier disposed between the electrostatic chuck and the first semiconductor substrate, the second-type workpiece comprising a second semiconductor substrate and lacking said electrically insulating carrier;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by the provided voltage.
1 more element
A method of manufacturing a device, the method comprising:
- providing a workpiece;
- and
- supporting the workpiece with an electrostatic chuck;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by a voltage supplied to the electrostatic chuck;
- wherein the voltage supplied to the electrostatic chuck is a first voltage when the workpiece is a first-type workpiece and a second voltage when the workpiece is a second-type workpiece, the first voltage being higher than the second voltage, the first-type workpiece including a first semiconductor substrate and an electrically insulating carrier attached to the first semiconductor substrate, the second-type workpiece including a second semiconductor substrate and lacking the electrically insulating carrier;
- wherein, when the workpiece is the first-type workpiece, the electrically insulating carrier of the first-type workpiece is disposed between the first semiconductor substrate and the electrostatic chuck.
3 more elements
A processing system, comprising:
- an electrostatic chuck configured to hold a workpiece;
- an optical sensing system configured to determine a type of the workpiece;
- and
- an AC power supply electrically coupled to the electrostatic chuck wherein the AC power supply is configured to provide a voltage depending upon the type of the workpiece;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by the provided voltage.
2 more elements
A method of manufacturing a device, comprising:
- providing an electrostatic chuck and a workpiece, the chuck configured to hold the workpiece;
- optically sensing a type of the workpiece;
- and
- causing an AC power supply to provide a voltage depending upon the type of the workpiece;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by the provided voltage.
2 more elements
Dependencies are inferred from the claim text.