Wafer cassette
AssigneeMpi Corporation
InventorsLin-Lin Chih, Chien-Hung Chen, Cheng-Rong Yang, Stojan Kanev
Life of this patent
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AssigneeMpi Corporation
InventorsLin-Lin Chih, Chien-Hung Chen, Cheng-Rong Yang, Stojan Kanev
Estimating the term…
A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
A wafer cassette, comprising:
A wafer cassette, comprising:
Dependencies are inferred from the claim text.