Method and apparatus for assembling and testing a multi-integrated circuit package
AssigneeXilinx, Inc.
InventorsGamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang, Jaspreet Singh Gandhi
Life of this patent
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Abstract
An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.
Claims16
A clamping assembly tray for packaging a semiconductor device, comprising:
- a frame having a bottom surface and side walls extending from the bottom surface that define a cavity;
- a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls;
- a heating element disposed in the frame beneath the bottom surface.
An apparatus for assembling an integrated circuit (IC) package, comprising:
- a frame having a bottom surface and side walls extending from the bottom surface that define a cavity;
- a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface, the support surface being between the bottom surface and a top edge of the side walls;
- a semiconductor device disposed on the support surface within the cavity, the semiconductor device comprising a substrate and a plurality of integrated circuit (IC) dies mounted to the substrate;
- a lid disposed on the semiconductor device;
- and
- thermal interface material disposed between the plurality of IC dies and the lid.
An apparatus for assembling an integrated circuit (IC) package, comprising:
- a frame having a bottom surface and side walls extending from the bottom surface that define a cavity;
- a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface, the support surface being between the bottom surface and a top edge of the side walls;
- a semiconductor device disposed on the support surface within the cavity;
- a lid disposed on the semiconductor device;
- and
- a weight disposed on top of the lid.
Dependencies are inferred from the claim text.