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US 10,096,490 B2Granted
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
AssigneeUTAC Headquarters Pte. Ltd.
InventorsSaravuth Sirinorakul, Suebphong Yenrudee
Life of this patent
Estimating the term…
Abstract
Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple molding routing layers in a plated and etched copper terminal semiconductor package by using an inkjet process to create conductive paths on each molding compound layer of the semiconductor package.
Claims14
A method of manufacturing semiconductor devices that each includes a plurality of conductive routing layers, comprising:
- obtaining an etched and plated leadframe that includes a plurality of copper routing circuits and a plurality of package terminals, wherein the plurality of copper routing circuits forms a copper leadframe routing layer;
- forming at least one conductive ink printed routing layer on top of the copper leadframe routing layer, wherein each of the at least one conductive ink printed routing layer is formed by:
- coupling a plurality of interconnections with routing circuits associated with a previous routing layer that is directly beneath a current conductive ink printed routing layer being formed;
- forming an intermediary insulation layer on top of the previous routing layer, wherein the plurality of interconnections protrudes from a top surface of the intermediary insulation layer that has the natural surface roughness;
- performing an abrasion procedure to roughen at least the top surface of the intermediary insulation layer such that, after the abrasion procedure, the top surface of the intermediary insulation layer has an unnatural surface roughness that is rougher than the natural surface roughness;
- and
- adhering a conductive ink layer on the roughened top surface of the intermediary insulation layer to form a plurality of conductive ink routing circuits that is included in the current conductive ink printed routing layer;
- coupling a plurality of dies with a topmost conductive ink printed routing layer;
- encapsulating the plurality of dies and the topmost conductive ink printed routing layer with a topmost insulation layer;
- etching away exposed copper at the bottom of the leadframe, thereby isolating the plurality of package terminals and exposing the plurality of copper routing circuits at the bottom of the leadframe;
- encapsulating the plurality of exposed copper routing circuits at the bottom of the leadframe with a bottommost insulation layer;
- and
- performing a cut-through procedure to singulate the semiconductor packages from each other.
10 more elements
A method of manufacturing semiconductor devices that each includes a plurality of conductive routing layers, comprising:
- obtaining an etched and plated leadframe that includes a plurality of copper routing circuits and a plurality of package terminals, wherein the plurality of copper routing circuits forms a copper leadframe routing layer;
- forming at least one conductive ink printed routing layer on top of the copper leadframe routing layer, wherein each of the at least one conductive ink printed routing layer is formed by:
- coupling a plurality of interconnections with routing circuits associated with a previous routing layer that is directly beneath a current conductive ink printed routing layer being formed;
- forming an intermediary insulation layer on top of the previous routing layer, wherein the plurality of interconnections protrudes from a top surface of the intermediary insulation layer that has the natural surface roughness;
- performing an abrasion procedure to roughen at least the top surface of the intermediary insulation layer such that, after the abrasion procedure, the top surface of the intermediary insulation layer has an unnatural surface roughness that is rougher than the natural surface roughness;
- and
- adhering a conductive ink layer on the roughened top surface of the intermediary insulation layer to form a plurality of conductive ink routing circuits that is included in the current conductive ink printed routing layer, wherein adhering a conductive ink layer includes printing conductive ink on the intermediary insulation layer and transforming the conductive ink on the intermediary insulation layer to a conductive solid;
- coupling a plurality of dies with a topmost conductive ink printed routing layer;
- encapsulating the plurality of dies and the topmost conductive ink printed routing layer with a topmost insulation layer;
- etching away exposed copper at the bottom of the leadframe, thereby isolating the plurality of package terminals and exposing the plurality of copper routing circuits at the bottom of the leadframe;
- encapsulating the plurality of exposed copper routing circuits at the bottom of the leadframe with a bottommost insulation layer;
- and
- performing a cut-through procedure to singulate the semiconductor packages from each other.
10 more elements
Dependencies are inferred from the claim text.