Electronic component

An electronic component comprising:

• a substantially rectangular parallelepiped multilayer body formed by laminating a plurality of insulation layers including a first insulation layers in a lamination direction;
• a capacitor including a plurality of capacitor conductor layers provided on main surfaces of the insulation layers;
• a substantially spiral-shaped inductor including one or more inductor conductor layers provided on main surfaces of the insulation layers and having a center axis extending along the lamination direction;
• and
• a first outer electrode and a second outer electrode that are electrically connected to the capacitor and the inductor and are provided on a mounting surface of the multilayer body, the mounting surface being a surface of the multilayer body located on the end of one side of a first orthogonal direction orthogonal to the lamination direction;
• wherein the inductor conductor layer and the capacitor conductor layer are provided on the main surfaces of the first insulation layer;
• on the main surfaces of the first insulation layer, an end portion of the capacitor conductor layer on the one side of the first orthogonal direction is closer to the mounting surface than an end portion of the inductor conductor layer on the one side of the first orthogonal direction;
• and
• no outer electrodes aside from the first outer electrode and the second outer electrode are provided.

An electronic component comprising:

• a substantially rectangular parallelepiped multilayer body formed by laminating a plurality of insulation layers including a first insulation layers in a lamination direction;
• a capacitor including a plurality of capacitor conductor layers provided on main surfaces of the insulation layers;
• and
• a substantially spiral-shaped inductor including one or more inductor conductor layers provided on main surfaces of the insulation layers and having a center axis extending along the lamination direction,
• wherein a mounting surface of the multilayer body is a surface of the multilayer body located on the end of one side of a first orthogonal direction orthogonal to the lamination direction;
• the inductor conductor layer and the capacitor conductor layer are provided on the main surfaces of the first insulation layer;
• on the main surfaces of the first insulation layer, an end portion of the capacitor conductor layer on the one side of the first orthogonal direction is closer to the mounting surface than an end portion of the inductor conductor layer on the one side of the first orthogonal direction;
• a direction orthogonal to the lamination direction and the first orthogonal direction is defined as a second orthogonal direction;
• a surface located on one side of the second orthogonal direction on the main surfaces of the insulation layers is defined as a first side, a surface located on another side of the second orthogonal direction on the main surfaces of the insulation layers is defined as a second side, and a surface located on the one side of the first orthogonal direction on the main surfaces of the insulation layers is defined as a third side;
• and
• on the main surface of the first insulation layer, when viewed from the lamination direction, the capacitor conductor layer straddles a region between the inductor conductor layer and the first side, a region between the inductor conductor layer and the third side, and a region between the inductor conductor layer and the second side.