Electronic device

An electronic device according to claim comprising:

• a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode;
• and
• an external terminal electrically connected to the terminal electrode,
• wherein the external terminal comprises:
• a terminal electrode connection part arranged to face the terminal electrode;
• and
• a mounting connection part connectable to a mounting surface,
• the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal,
• a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
• a thermal expansion coefficient of the first metal by itself is larger than that of the ceramic element body,
• a thermal expansion coefficient of the second metal by itself is smaller than that of the ceramic element body, and
• a thermal expansion coefficient of the third metal by itself is larger than that of the ceramic element body.

An electronic device comprising:

• a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode;
• and
• an external terminal electrically connected to the terminal electrode,
• wherein the external terminal comprises:
• a terminal electrode connection part arranged to face the terminal electrode;
• and
• a mounting connection part connectable to a mounting surface,
• the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal,
• a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
• a thermal expansion coefficient of the first metal by itself is smaller than that of the ceramic element body,
• a thermal expansion coefficient of the second metal by itself is larger than that of the ceramic element body, and
• a thermal expansion coefficient of the third metal by itself is smaller than that of the ceramic element body.

An electronic device comprising:

• a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode;
• and
• an external terminal electrically connected to the terminal electrode,
• wherein the external terminal comprises:
• a terminal electrode connection part arranged to face the terminal electrode;
• and
• a mounting connection part connectable to a mounting surface,
• the terminal electrode connection part comprises a multilayer structure of a first metal connected to the terminal electrode and a second metal arranged outside the first metal,
• a thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body,
• a thickness of the first metal is 10 μm or more,
• the thickness of the first metal is smaller than that of the second metal,
• a constitution ratio of the second metal in the external terminal is 40% or more,
• a thermal expansion coefficient of the first metal by itself is larger than that of the ceramic element body, and
• a thermal expansion coefficient of the second metal by itself is smaller than that of the ceramic element body.