Chip resistor and method for manufacturing same

A method for manufacturing chip resistors, in which a large-sized substrate is divided along division lines arranged in a grid pattern so that chip resistors each having a resistor body and a pair of front electrodes can be obtained collectively, the method comprising the steps of:

• forming primary division grooves and secondary division grooves in the large-sized substrate, the primary division grooves and the secondary division grooves extending lengthwise and widthwise;
• forming pairs of front electrodes on a front surface of the large-sized substrate to be laid across the primary division grooves;
• forming resistor bodies connected to the pairs of the front electrodes;
• forming a protective layer to cover the pairs of the front electrodes and the resistor bodies;
• dividing the large-sized substrate along the primary division grooves to form strip-shaped substrates;
• rubbing the front electrodes exposed in division surfaces of the strip-shaped substrates to form bent portions on end surfaces of the protection layer;
• forming end-surface electrodes on the division surfaces of the strip-shaped substrates to cover the bent portions;
• and
• dividing the strip-shaped substrates along the secondary division grooves to form individual chip elements.