Portable electronic device and detachable auxiliary heat-dissipating module thereof

A portable electronic device comprising:

• a predetermined receiving groove formed therein;
• a power connector;
• a fixed main heat-dissipating module fixed therein and having a main heat pipe;
• and a detachable auxiliary heat-dissipating module contacting the fixed main heat-dissipating module and having:
• an outer casing structure including a detachable casing detachably disposed inside the predetermined receiving groove and an electrical connector disposed on the detachable casing and electrically connected to the power connector;
• and
• an inside mounted heat-dissipating structure disposed inside the detachable casing, wherein the inside mounted heat-dissipating structure includes an inside mounted heat-dissipating fan electrically connected to the electrical connector, a plurality of inside mounted heat-dissipating fins adjacent to the inside mounted heat-dissipating fan, and an auxiliary heat pipe passing through the inside mounted heat-dissipating fins,
• wherein the auxiliary heat pipe has a heat-conducting pad disposed on a lateral contact surface of the auxiliary heat pipe and exposed from the detachable casing to directly contact a lateral contact surface of the main heat pipe and one selected from a top contact surface and a bottom contact surface of the main heat pipe of the fixed main heat-dissipating module by way of detachable connection, such that heat generated by the main heat pipe of the fixed main heat-dissipating module is partially transmitted to the auxiliary heat pipe through the heat-conducting pad, wherein the lateral contact surface of the auxiliary heat pipe and the lateral contact surface, the top contact surface and the bottom contact surface of the main heat pipe are plane surfaces, and a contacting area between the lateral contact surface of the auxiliary heat pipe and the heat-conducting pad is larger than that between the lateral contact surface of the main heat pipe and the heat-conducting pad and that between the heat-conducting pad and the one selected of the top contact surface and the bottom contact surface of the main heat pipe.