Hardware shield device and electronic devices including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJun Hur, Seung Ki Choi, Seung Bum Choi
Life of this patent
Estimating the term…
Abstract
A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.
Claims20
A device comprising:
- a shield can including an opening through which at least a part of a device element is exposed;
- a heat dissipation element including at least a part that faces the part of the device element exposed through the opening;
- a cover member connected to a topmost surface of the heat dissipation element;
- and
- a conductor arranged between the shield can and the cover member, the conductor surrounding the opening and at least a part of a periphery of the heat dissipation element,
- wherein the conductor includes an open hole corresponding to the opening, and
- wherein a size of the open hole is smaller than a size of the opening.
An electronic device comprising:
- a printed circuit board;
- an electronic chip arranged on the printed circuit board;
- a shield can including an opening through which at least a part of the electronic chip is exposed;
- a heat dissipation element including at least a part that faces the part of the electronic chip exposed through the opening or on a periphery of the opening;
- a cover member connected to a topmost surface of the heat dissipation element;
- and
- a conductor surrounding the opening and a periphery of the heat dissipation element,
- wherein the conductor includes an open hole formed in at least a part of a center of the conductor so as to correspond to the opening, and
- wherein a size of the open hole is smaller than a size of the opening.
A device comprising:
- a shield can including an opening through which at least a part of a device element is exposed;
- a heat dissipation element including at least a part that faces the part of the device element exposed through the opening;
- a cover member connected to a topmost surface of the heat dissipation element;
- and
- a conductor arranged between the shield can and the cover member, the conductor surrounding at least a part of a gap between a peripheral region of the opening and a peripheral region of the heat dissipation element,
- wherein the conductor includes an open hole formed in at least a part of a center of the conductor so as to correspond to the opening, and
- wherein a size of the open hole is smaller than a size of the opening.
Dependencies are inferred from the claim text.