Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern

Abstract

The present invention provides a photosensitive resin composition including: an alkali-soluble resin (A) having more than 30% by mass and less than 70% by mass of a structural unit represented by the Formula (1) below; a compound (B) having at least one ethylenically unsaturated double bond per molecule; and a photo radical polymerization initiator (C) having an oxime ester structure; wherein a content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the alkali-soluble resin (A) is 3 to 20 parts by mass. In Formula (1), R1 represents a hydrogen atom or a C1-4 alkyl group. R2 represents a single bond or a divalent organic group. R3 each independently represent a hydrogen atom, a hydroxyl group, or an optionally substituted alkyl group.

Dependencies are inferred from the claim text.