Radio-frequency localization techniques and associated systems, devices, and methods
AssigneeHumantics Corporation
InventorsGregory L. Charvat, David A. Mindell
Life of this patent
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Abstract
A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.
Claims20
A device comprising:
- a substrate;
- a semiconductor die mounted on the substrate;
- a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency;
- a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency that is a harmonic of the first center frequency;
- and
- circuitry integrated with the semiconductor die mounted on the substrate and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna,
- wherein the transmit antenna is configured to transmit a first RF signal having the first center frequency to a target device,
- wherein the receive antenna is configured to receive a second RF signal having the second center frequency from the target device, and
- wherein the circuitry is configured to generate, based on the first RF signal and the second RF signal, a third RF signal indicative of a time-of-flight between the device and the target device.
A device comprising:
- a substrate;
- a semiconductor die mounted on the substrate;
- a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals circularly polarized in a first rotational direction;
- a receive antenna fabricated on the substrate and configured to receive RF signals circularly polarized in a second rotational direction different from the first rotational direction;
- and
- circuitry integrated with the semiconductor die mounted on the substrate and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna
- wherein the transmit antenna is configured to transmit a first RF signal having the first center frequency to a target device,
- wherein the receive antenna is configured to receive a second RF signal having the second center frequency from the target device, and
- wherein the circuitry is configured to generate, based on the first RF signal and the second RF signal, a third RF signal indicative of a time-of-flight between the device and the target device.
A system, comprising:
- an interrogator device, comprising:
- a first substrate;
- a first semiconductor die mounted on the first substrate;
- a first transmit antenna fabricated on the first substrate and configured to transmit radio-frequency (RF) signals having a first center frequency to a target device;
- a first receive antenna fabricated on the first substrate and configured to receive, from the target device, RF signals having a second center frequency that is a harmonic of the first center frequency;
- and
- first circuitry integrated with the first semiconductor die mounted on the first substrate and configured to provide RF signals to the first transmit antenna and to receive RF signals from the first receive antenna;
- and
- the target device, comprising:
- a second substrate;
- a second semiconductor die mounted on the second substrate;
- a second receive antenna fabricated on the second substrate and configured to receive, from the interrogator device, RF signals having the first center frequency;
- a second transmit antenna fabricated on the second substrate and configured to transmit, to the interrogator device, RF signals having the second center frequency;
- and
- second circuitry integrated with the second semiconductor die mounted on the second substrate and configured to:
- generate, from RF signals provided from the second receive antenna and having the first center frequency, RF signals having the second center frequency, and
- provide the generated RF signals having the second center frequency to the second transmit antenna.
Dependencies are inferred from the claim text.