Systems and methods for reliable integrated circuit device test tooling
AssigneeEssai, Inc.
InventorsNasser Barabi, Hans Dieter Huber, Joven R. Tienzo, Chee Wah Ho
Life of this patent
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Abstract
In one embodiment of the present invention, a test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force. The pad provides mechanical support and/or electric coupling for the plurality of probes. In turn, the PCB/interposer supports the pad. In some embodiments, the plurality of probes includes a hard core material such as diamond. In other embodiments, the surface of the probes is hardened.
Claims14
A test probe assembly useful for testing packaged integrated circuit (IC) devices, the test probe assembly comprising:
- a plurality of singular probes configured to repeatedly maintain electrical contact with a corresponding plurality of DUT contacts when under a compliant contact force, each of the plurality of probes having a core that does not deform under repeated contact with the corresponding plurality of DUT contacts under pressure, and wherein the compliant contact force delivered to DUT ensures proper alignment between the DUT contacts and the probes thereby avoiding damage to the DUT;
- a low-profile pad configured to directly support the plurality of probes;
- a PCB configured to support the pad;
- and
- wherein the compliant contact force delivered to the DUT ensures proper alignment between the DUT contacts and the probes thereby avoiding damage to the DUT.
A test probe assembly useful for testing packaged integrated circuit (IC) devices, the test probe assembly comprising:
- a plurality of singular probes configured to repeatedly maintain electrical contact with a corresponding plurality of DUT contacts when under a compliant contact force, each of the plurality of probes having a conductive surface that does not deform under repeated contact with the corresponding plurality of DUT contacts under pressure;
- a low-profile pad configured to directly support the plurality of probes;
- a PCB configured to support the pad;
- and
- wherein the compliant contact force delivered to the DUT ensures proper alignment between the DUT contacts and the probes thereby avoiding damage to the DUT.
Dependencies are inferred from the claim text.