Surface acoustic wave sensors in semiconductor processing equipment

A wireless or radio-frequency responsive sensing device, comprising:

• a transmitter coupled to at least one chamber component, the transmitter comprising:
• a first ceramic layer having a first face and a second face, the first face having a protective coating disposed thereon;
• a second ceramic layer having a third face and a fourth face, wherein the third face is opposite the fourth face, the second face contacts the third face, and the fourth face has a protective coating disposed thereon;
• a first antenna disposed between the second face of the first ceramic layer and the third face of the second ceramic layer;
• a sensor disposed between the second face of the first ceramic layer and the third face of the second ceramic layer;
• and
• a first waveguide embedded within the first ceramic layer or the second ceramic layer;
• and
• a receiver operable to communicate with the transmitter at a sensing frequency, the receiver comprising:
• a third ceramic layer;
• a fourth ceramic layer contacting the third ceramic layer;
• a second antenna disposed between the third ceramic layer and the fourth ceramic layer;
• and
• a second waveguide disposed between the third ceramic layer and the fourth ceramic layer.

A wireless or radio-responsive sensing device, comprising:

• a transmitter coupled to at least one chamber component and disposed inside a processing volume of a processing chamber, the transmitter comprising:
• a first ceramic layer;
• a second ceramic layer contacting the first ceramic layer;
• a first antenna disposed between the first ceramic layer and the second ceramic layer;
• a sensor disposed between the first ceramic layer and the second ceramic layer;
• and
• a first waveguide comprising a metal material, wherein the first waveguide is embedded within the first ceramic layer or the second ceramic layer, and wherein the first waveguide comprises a first filter to allow a sensing frequency to pass therethrough;
• and
• a receiver disposed outside of the processing volume, wherein the receiver is operable to communicate with the transmitter at the sensing frequency, the receiver comprising:
• a third ceramic layer;
• a fourth ceramic layer contacting the third ceramic layer;
• a second antenna disposed between the third ceramic layer and the fourth ceramic layer;
• and
• a second waveguide disposed between the third ceramic layer and the fourth ceramic layer, wherein the second waveguide comprises a second filter to allow the sensing frequency to pass therethrough.