US 10,094,717 B2Granted

Thermal sensing device

AssigneeNational Kaohsiung University of Applied Sciences

InventorsChung-Nan Chen, Chih-Chun Chen, Chun-Hao Chen, Wen-Chie Huang

Life of this patent

Estimating the term…

Loading patent…

Abstract

A thermal sensing device comprises a substrate, a first insulating layer, at least one first sensing resistor, at least one second sensing resistor, a plurality of etching holes and a cavity. The first insulating layer is disposed on the substrate. The first sensing resistor is disposed above the first insulating layer. The second sensing resistor is disposed above the first insulating layer and isolated from the at least one first sensing resistor. The etching holes are disposed around the at least one first sensing resistor and the at least one second sensing resistor. The cavity is formed below the at least one first sensing resistor and the at least one second sensing resistor. The thermal sensing device is implemented in a measurement circuit to improve the problem that the signal becomes smaller when the sensing element is minimized.

Claims11

Dependent claims

A thermal sensing device, comprising:

a substrate;
a first insulating layer disposed on the substrate;
at least one first sensing resistor disposed above the first insulating layer;
at least one second sensing resistor disposed above the first insulating layer;
a plurality of etching holes disposed around the at least one first sensing resistor and the at least one second sensing resistor;
a cavity formed below the at least one first sensing resistor and the at least one second sensing resistor;
wherein the thermal sensing device is implemented in a measurement circuit, the measurement circuit includes a first resistor, a second resistor, a third resistor, and a fourth resistor, and the at least one first sensing resistor and the at least one second sensing resistor are respectively implemented to be at least two of the first resistor, the second resistor, the third resistor, and the fourth resistor of the measurement circuit.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/978,838Filed 22 Dec 2015
Published: US 2017/0176263 A122 Jun 2017
Granted: 9 Oct 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G01K 7/24
The element being a non-linear resistance, e.g. thermistor: in a specially-adapted circuit, e.g. bridge circuit
G01K 7/226
The element being a non-linear resistance, e.g. thermistor: using microstructures, e.g. silicon spreading resistance
G01L 9/0055
Of piezoresistive elements: bonded on a diaphragm
G01L 19/0092
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or…