Micro-channel heat sink for LED headlamp
AssigneeFlex-N-Gate Advanced Product Development, LLC
InventorsMuhammed Aquil Hamid, Steve Barman, Charles F. Schweitzer
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AssigneeFlex-N-Gate Advanced Product Development, LLC
InventorsMuhammed Aquil Hamid, Steve Barman, Charles F. Schweitzer
Estimating the term…
The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate.
A heat sink for a semiconductor device, the heat sink comprising:
A lamp for a vehicle, the lamp comprising:
Dependencies are inferred from the claim text.