SiC single crystal and method of producing same

A method of producing a SiC single crystal by a solution process, in which a SiC seed crystal is contacted with a Si—C solution with a temperature gradient such that the temperature of the Si—C solution decreases from the inside of the Si—C solution toward a surface of the Si—C solution, allowing the SiC single crystal to grow,

• wherein the method comprises:
• preparing a first SiC seed crystal comprising a bottom surface being a c-plane, a top surface held by a graphite shaft, and side surfaces, wherein the first SiC seed crystal contains threading dislocations;
• contacting the bottom surface and the side surfaces of the first SiC seed crystal with the Si—C solution while keeping the bottom surface of the first SiC seed crystal parallel to the surface of the Si—C solution to form a meniscus between the side surfaces of the first SiC seed crystal and the Si—C solution such that the graphite shaft does not come in contact with the Si—C solution;
• performing c-plane growth to grow a first SiC single crystal from the first SiC seed crystal allowing a diameter of the growing first SiC single crystal to enlarge so that the first SiC single crystal having the first SiC seed crystal, a c-plane growth portion, and an enlarged diameter portion, is obtained;
• cutting out a second SiC seed crystal out of the first SiC single crystal so that the cut-out second SiC seed crystal consists of the first SiC seed crystal and the enlarged diameter portion grown on an upper side of the bottom surface of the first SiC seed crystal, and has a c-plane, or cutting out a second SiC seed crystal out of the first SiC single crystal so that the cut-out second SiC seed crystal consists of the c-plane growth portion and the enlarged diameter portion grown on a lower side of the bottom surface of the first SiC seed crystal, and has a c-plane;
• and
• further growing a second SiC single crystal from the c-plane of the second SiC seed crystal, wherein the second SiC single crystal does not contain threading dislocations, basal plane dislocations, and stacking faults.